The Diamond Loop Wire Saw is an incredibly versatile and high-performance cutting tool, designed for precision cutting of hard, brittle, and delicate materials such as sapphire, glass, ceramics, silicon, marble, precious metals, and advanced composite materials. Operating at high speeds of 30–60 m/s, this flexible diamond wire saw ensures clean, efficient cuts with minimal material loss, making it ideal for applications ranging from gemstone and semiconductor wafer slicing to stone, glass, and ceramic cutting.

Two Diameter Options for Maximum Versatility

• 0.5–1.0 mm Diameter: Best suited for cutting artificial crystals, gemstones, ceramics, and precious metals with precision.

• 1.0–3.0 mm Diameter: Ideal for graphite, plastics, rubber, concrete, fiberglass, and foamed cement, providing stability and efficiency on tougher surfaces.

Key Specifications

• High-Efficiency Cutting: 30–60 m/s for fast and precise operation.

• Wire Diameter: 0.3–3.0 mm to meet various cutting requirements.

• Wire Length: 800–100,000 mm for compatibility with modern wire cutting machines.

• Environment: Suitable for wet and dry cutting applications.

• Cutting Directions: Customizable, including curved surfaces.

• Ease of Use: Simple operation and quick wire replacement for hassle-free maintenance.

Types of Diamond Loop Wire Saws

1. Continuous Loop Diamond Wire Saw:

   • Single continuous diamond-coated wire threaded through pulleys.

   • Highly versatile for a wide range of applications including stone, ceramics, glass, and gemstones.

2. Segmented Endless Diamond Wire Saw:

   • Wire divided by regularly spaced diamond segments for precision cutting.

   • Reduces friction, heat, and wear while producing clean, smooth cuts.

   • Ideal for delicate tasks requiring minimal chipping or material loss.

Key Features

• Diamond-Coated Wire: Embedded or coated diamond particles provide exceptional hardness and cutting efficiency.

• Precision Cutting: Perfect for intricate shapes, thin sections, and delicate materials.

• Clean and Smooth Cuts: Reduces the need for additional finishing or polishing.

• Versatility: Suitable for glass, stone, ceramics, semiconductors, and composites.

• Reduced Heat and Vibration: Minimizes thermal damage and ensures consistent accuracy.

Applications

• Stone & Marble Cutting: Slabbing, shaping, and intricate design work in natural and engineered stones.

• Glass Cutting: Precision cuts for panels, windows, and architectural glass.

• Ceramics: Cutting tiles, bricks, and specialty ceramic components.

• Semiconductor Industry: High-precision cutting of silicon wafers and other semiconductor materials.

• Composite Materials: Aerospace, automotive, and industrial composites.

• Art & Sculpture: Creating intricate designs from hard materials.

• Research & Development: Sample preparation and material analysis in laboratories.

Why Choose Diamond Loop Wire Saw

With flexible diamond loop technology, superior tensile strength, and customizable options for diameter, length, and grit, the Diamond Loop Wire Saw offers unparalleled precision, efficiency, and durability. Whether used in semiconductor wafer slicing, sapphire cutting, tire section machines, or custom lapidary work, it delivers consistent results while minimizing material waste and operational downtime.

HANS Diamond Loop Wire Saws are trusted by professionals and researchers worldwide for reliable cutting performance, versatility, and long-lasting durability across a wide range of