Performance

Diamond ID Dicing Blades are specialized cutting tools designed for high-precision slicing of brittle and hard materials, originally developed for germanium and silicon semiconductor wafers. Today, they are widely used for cutting a variety of materials, including GGG, samarium-cobalt, sapphire, magnetic irons, gallium arsenide/phosphide, and quartz.

Key Features:

• Diamond Abrasive Edge: Embedded diamond particles provide exceptional hardness, precision, and long-lasting performance.

• Inner Diameter (ID) Design: Central hole allows mounting on specialized dicing saws or equipment arbors.

• Ultra-Thin Profile: Minimizes material wastage and kerf width, ensuring accurate cutting.

• High Precision: Engineered for minimal chipping and smooth surfaces, critical for semiconductor and electronics applications.

• Coolant Compatible: Designed for use with deionized water or specialized cutting fluids to dissipate heat and remove debris.

Applications:

• Semiconductor Manufacturing: Dicing silicon wafers into individual microchips or dice for integrated circuits.

• Electronics Manufacturing: Cutting LEDs, MEMS devices, sensors, and other electronic components.

• Optics & Photonics: Producing glass lenses, prisms, and optical fibers.

• Precision Cutting of Hard Materials: Including ceramics, glass, sapphire, and certain metals.

• R&D & Lab Use: Preparing samples for materials analysis and scientific research.

Custom Design Options:

• Blades are tailored with specific parameters such as core thickness (C), kerf thickness (K), and diamond depth (D) based on customer material and cutting requirements.

• Sourced from high-quality raw materials with strict tolerances for consistent performance.

Safety & Usage Guidelines:

• Follow manufacturer instructions and machine setup carefully.

• Wear appropriate PPE (eye protection, gloves, protective clothing).

• Ensure proper coolant use to maintain blade integrity and prevent overheating.

• Inspect blades regularly for wear or damage.

Investing in Diamond ID Dicing Blades ensures accurate, efficient, and high-quality cuts for semiconductor, electronics, optical, and precision materials applications.