Diamond Wafer Dicing Blades

Nickel Bond dicing blades are available with and without hubs. Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.Diamond Grit 3 to 70 micron,Minimum Dicing Blade Thickness  .0003" (0.0076mm).

Nickel Bond Dicing Blades have  a  high  diamond  concentration  and  give  a  freer,  faster  cutting  action  with  minimum  heat  generation. Diamonds have higher protrusion ratio, staying on the surface of the cut allowing for fast material removal. Electroplated Diamond Blades last less than metal bond, resin bond, hybrid bond blades and are the least expensive diamond blades available.  Silicon wafer dicing is usually done with the plated diamond blade (hubbed or hubbless) which has proven most effective for this application. The Kerfs are typically in the 1-3 mil. range using a nominal spindle speed of 30,000 RPM with feed rates as high as 8 inch per sec.

Flange for Hubless Dicing Blades
Flange for Hubless Dicing Blades
Diamond Precision Dicing Blade
Diamond Precision Dicing Blade
Show More

Hans Diamond Abrasive Materials Co.,Ltd    Add:111th Liuquan Road Zibo Shandong China 255000  Tel/Fax:0086 533 3184412

  

Relation Links: 

  Flexible Diamond Product        Diamond Lapidary Tool     Diamond Wire Saw Loop     Diamond Glass Tool 

           Diamond Products                     Abrasive Glass Tool              Abrasive Products             Lapidary Grinder Saw