Diamond ID Dicing Blades

ID saw blades were initially used primarily for slicing germanium and silicon semiconductor materials. A majority of ID saw blades are still used to process these materials. Now a broader set of materials such as GGG, samarium-cobalt, sapphire, magnetic irons, gallium arsenide/phosphide, and quartz are sliced using ID saw technology.

  • Nifec I.D. blades are custom designed with a unique cutting edge specific to the customers needs.

  • We pay close attention to the needs of the customer with the material they are cropping/cutting and adjust parameters accordingly.

  • Parameters such as C (core thickness), K (kerf thickness), and D (diamond depth) are customer specific.

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  • We source only the highest quality raw materials for our I.D. blades.

  • We employ some of the strictest tolerances in the industry to ensure a consistent product.

  • We supply all major sizes in the industry, including but not limited to these 

Flange for Hubless Dicing Blades
Flange for Hubless Dicing Blades
Diamond Wafer Dicing Blades
Diamond Wafer Dicing Blades
Flange for Hubless Dicing Blades
Flange for Hubless Dicing Blades
Metallurgical Supplies
Metallurgical Supplies
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Hans Diamond Abrasive Materials Co.,Ltd    Add:111th Liuquan Road Zibo Shandong China 255000  Tel/Fax:0086 533 3184412

  

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